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Featuring the world’s first “PISA” supercritical foam technology, the “XTEP ACE” cushioning technology provides superb rebound while remaining lightweight. Its world-class T700 carbon fiber plate provides powerful propulsion for runners. Its ultra-thin and lightweight CPU outsole offers excellent wear resistance to help runners make breakthroughs in their top speed.

Featuring the world’s first “PISA” supercritical foam technology, the “XTEP ACE” cushioning technology provides superb rebound while remaining a lightweight design. The incorporation of a high-intensity T400 carbon fiber plate and marathon-grade CPU outsole ensures a better t for Chinese feet, enhanced propulsion, and excellent wear resistance.

Equipped with “XTEP ACE” cushioning technology, it efficiently absorbs landing shock and provides responsive rebound. Its T400 carbon fiber plate enhances propulsion, stability, and offers a comfortable t for Chinese feet.

Equipped with “XTEP ACE” cushioning technology, it offers runners with quick rebound while remaining lightweight. It features a built-in TPU stabilization device and it is fitted with light, wear-resistant rubber strategically placed at the stress points of the gait, enhancing foot support, stability, and improving wear and slip resistance.

The unique hollow structure design provides effective structural cushioning. The double-layered hollow design of the rear sole section also enhances the space and level of force deformation to provide good shock absorption performance.

The special polymer material is lightweight and offers good pressure resistance, allowing runners to experience a light and rebounding stride with every step they take during exercise.

The newly developed PTU foam particles offer remarkable supple rebound capability and excellent compression durability. Experiments have shown a signi cant increase in resilience and a reduction in energy loss compared with ordinary materials, creating a comfortable exercise experience with dynamic rebound performance.

The lightweight midsole materials and TPU hollow structure of the full-foot midsole effectively reduces the weight of the outsole and dissipate heat from the foot, helping to evaporate sweat from the sole of the foot, circulate air in and out of the shoe cavity, and reduce load during exercising.

Features a cushioning system comprising single or multiple air cushion structures of varying shapes. Its assortment is based on dynamic pressure distribution on the sole, resulting in effective pressure-buffer and shock absorption during exercising.

After conducting an in-depth study on the human gait and distribution of stress points, a collection of independent soft cube modules for the sole was developed, which can arrange flexibly according to the dynamic pressure distribution of the sole, providing a comfortable stepping experience.